High Technology Solutions (HTS) is a full-service test manufacturing sales representation firm focused on complete end to end solutions from back-end test and measurement to back-end quality control and recovery. At HTS, we are committed to meeting the needs of our customers and manufacturers in the highly competitive electronics world by providing reliable sales representation and third party services.

Gravity IC Test Handlers – Rasco

SO1000 Single, Dual, Quad Contacting Throughput up to 14,400 IC’s/hour Index Time < 0.45 s Conversion kits for all SO and QFN devices Split kit capability Ambient/Hot/Tri-Temp -60C to +175C Large variety of Contactors: Kelvin, RF, Pogo, ECT Johnstech, Yamaichi, C-Type MEMS applications for magnetic, optical, pressure and acoustic sensors Automatic tube loading and unloading Rotary Track (RT) option: Soak capacity 16 Tubes Small Footprint

SO1800 Up to 8 Contact Sites Throughput up to 28,800 IC’s/hour Index Time <0.45 s Conversion kits for all SO, QFN and TO devices Split kit capability Ambient/Hot/Tri-Temp -60C to +175C Large variety of Contactors: Kelvin, RF, Pogo, ECT Johnstech, Yamaichi, C-Type MEMS applications for magnetic, optical, pressure and acoustic sensors Automatic tube and metal magazine loading and unloading Rotary Track (RT) option: Soak capacity 16 Tubes

SO2000 Single, Dual, Quad Contacting Throughput up to 16,000 IC’s/hour Index Time <0.45 s Conversion kits for all SO and QFN devices INCLUDING 1.5 mm x 1.5 mm x 0.4mm 49 mill, 51 mill, 63 mill SOT Devices Split kit capability Ambient/Hot/Tri-Temp -60C to +175C Large variety of Contactors: Kelvin, RF, Pogo, ECT Johnstech, Yamaichi, C-Type MEMS applications for magnetic, optical, pressure and acoustic sensors Multiple input and output modules: Tube, bowl (SOT and QFN), metal magazine, bulk, tape & reel Vision for Mark/3D-lead/intape inspection Small Footprint

SO2800 Up to 8 contact sites Loadboard compatibility Throughput up to 28,800 IC’s/hour Index Time <0.45 s Conversion kits for all SO and QFN devices INCLUDING 1.5 mm x 1.5 mm x 0.4mm 49 mill, 51 mill, 63 mill SOT Devices Split kit capability Ambient/Hot/Tri-Temp -60C to +175C Large variety of Contactors: Kelvin, RF, Pogo, ECT Johnstech, Yamaichi, C-Type MEMS applications for magnetic, optical, pressure and acoustic sensors Multiple input and output modules: Tube, bowl (SOT and QFN), metal magazine, bulk, tape & reel Vision for Mark/3D-lead/intape inspection Small Footprint

SO3000 Parallel testing with multiple contact sites Index time; 150 ms device to device, 1.8 s strip to strip Slotted or stacked cassette loading/unloading Ambient/Hot/Tri-Temp -60C to +160C All common types of lead frame and substrate based strips Integrated Strip code reader at input and output SMEMA module interconnection Strip mapping according to SEMI standard, different protocols for host communication Automatic strip alignment with vision system for extremely high positioning accuracy Adjustable test force up to 2,000 N Integrated laser marker Additional soak module for higher soak capacity

Test Head Positioning and Hard Docking – inTest

Test Head Positioner Utilize 6 different kinds of motion to quickly position the test head for alignment to a handler or prober. UL, EU, Semi certified Approved supplier of Positioner's for Teradyne Credence Eagle LTX Nextest KVD Positioner’s are tested to handle loads from 50 KG to 700KG Our positioner's allow you to change test set-ups fast, Powered Axis Vertical Horizontal Tumble Twist

Docking Hardware When you choose inTEST, you get the finest docking available, from the most experienced team in the industry. inTEST has designed and manufactured more than 5,000 docking systems for over 175 different test heads, 30 prober types, And 300 different handlers. Approved supplier for the following tester companies Teradyne Credence Eagle LTX Nextest KVD Designed with Precision mechanical components to decrease set up time, increase hardware Reliability and life time fine and course alignment features allowing your tester to engage peripheral equipment with out damaging costly hardware

Prober Interface's and Final Test Sockets – inTest

Prober Interface Increased yield through Unsurpassed Signal integrity Invisible to the tester Precision mechanical components to decrease set up time Approved supplier for Teradyne Credence Eagle LTX Nextest KVD Modular design allows you to increase the pin count as your tester channels increase

Final Test Socket Pogo Pin Based Socket Utilize any pin manufacturer in the world Vespel Aerospace material Hold all machined mechanical tolerances Will not grow or deform Superior for Temperature Will not contract or expand Superior for Machining Will not “potatoe chip” or deform during machinig Optimized Electrical Performance Pitch 0.35mm, 0.4mm, 0.5mm, 0.8mm, 1.00mm, 1.27mm Self Inductance As low as 0.4nH Bandwidth 20GHz Resistance <50mOhms Current Capacity Up to 5 Amps per pin Capacitance As low as 0.26pF

Precision Temperature Forcing and Controlling Equipment – Temptronic

Thermostream Provide a stream of precisely temperature controlled air that quickly brings test parts to a desired temperature Range from -80C to +225C 30 Seconds to transition the full range Mobile modular systems can test Components, IC’s, high speed or high power devices Hybrid circuits Modules or MCM’s Printed circuit boards and other assemblies Electro-mechanical assemblies

Thermal Chamber Used with Themostreams to provide an ideal environment for moisture-free controlled temperature tests Standard sizes and configurations 12” x 12” x 5” to 3 Cubic feet

Temperature Probing Thermo Chuck systems provide Vacuum platforms that provide high and low temperature at Probe up to 300mm Range of Temperature from -65C to +400C Femtoamp-level probing Low noise, high electrical isolation, low stray capacitance testing High power device testing High probe load testing High Voltage testing Approved supplier for TEL Accrutech Electroglass KLA

Non-Destructive Internal Failure Analysis – Sonoscan

Gen-5 Turbo ModeTM: up to 2.5X Faster Scanning Semi-Production Capable with a Two JEDEC Tray Scan Area (1 sq. ft.) Clean Room Ready Open Access for Easy Loading & Unloading ESD Safe Multi-Language Menus & OS (English, Traditional Chinese & Japanese) Integrated C-SAM Interactive for AM Imaging Guidance & Reference Gated Trigger Mode for Elimination of Background Noise Bright Ambient Sample Stage Lighting Active Sensor Detects Presence of Installed Transducer Advanced Applications Software Wafer Analysis Bondline Analysis for Zero-Level Packaging Region Specific Analysis for Electronic Devices Improved TrayScanTM Flip Chip Underfill Void & Solder Bump Support Numerous Time Saving and Operator Convenience Features Virtual Rescanning Mode (VRMTM) with Profile and Frequency Domain Imaging (FDITM) Capabilities Available

D-9500 Time Domain Imaging (TDI)™ Balanced Linear Scanner Larger Maximum Scan Area, While Maintaining Accuracy More Accessibility to Samples Multi-Language OS and Visual Acoustics™ Interface Digital Image Analysis (DIA)™ Optional Waterfall Transducer™ Optional Temperature Control Options Applications Set-up Wizard™ Quantitative B-Scan Analysis Mode (Q-BAM)™

FACTs Sonoscan Waterfall™ transducer provides non-immersion scanning, which minimizes risks of contamination, fluid ingression and movement due to floating of parts In-line or stand-alone operation flexibility to best meet your production and quality control requirements Automated Data Analysis Package allows you to predefine accept/reject criteria and automatically indicates rejected parts within the data image or file TurboSpeed™ provides faster imaging speeds at high frequencies with up to 2.5X increased image acquisition speed with high pixel densities Vacuum Hold-Down option holds small parts in place and eliminates shifting during scanning to ensure the highest quality images Four-stage dryer with three air knives and vacuum unit to quickly and efficiently dry parts after scanning Temperature control options to maintain precise water temperature and ensure consistent imaging throughout the day, regardless of changes in ambient air temperature

SonoLab Materials Characterization and Qualification High-Capacity Screening and Lot Reclamation Failure Analysis Inspection and Audit Services Training Qualification Programs IPC/JEDEC NASA EIA/ICA Military Standard Military Performance Specification

Mark, Pack and Visual Inspection – MicroVision

MV 996i High Speed Tray to Tray 3D Inspection Transfer of multiple units to 3D scanning on a magnetic linear slide achieving finest accuracy producing repeatable results 3D inspection on the “FLY” with a field of view up to 50mm, without use of a rotary lens or kit Simple conversion 5 Minute conversion Keyless chuck for changeover no tools required Utilize a multiple pick up head Dual pick and place mechanism for the reject and replenish station Mark re-verification and position of the unit in tray after inspection Optional Dual Tape and Reel output Mark Inspection Missing, incomplete or incorrect characters and logos, including Smeared, blurred, scratched, low contrast, angel, misaligned, reversed, double and additional mark Package Visual Inspection 60X60 um Detection of Scratches, Chip Out, Void’s and Contamination UPH 40K

MV 998D 3D inspection on the “FLY” with a field of view up to 50mm, without use of a rotary lens or kit Revolutionized 3 pickup head mechanism Built in Auto Precisor Keyless no tools required to adjust when changing the package size In tray mark inspection Missing, incomplete or incorrect characters and logos, including Smeared, blurred, scratched, low contrast, angel, misaligned, reversed, double and additional mark Dual Tape and Reel 2D vision for In Tape, Orientation, and Gross Lead Inspection Auto replacement mechanism Simple conversion 30 Minute conversion time from device type too type 3 Pickup heads with built in precisor designed to adjust automatically to different size packages Package Visual Inspection 60X60 um Detection of Scratches, Chip Out, Void’s and Contamination PH 10K

Deprocessing Failure Analysis Equipment – Nisene

Package Decap Jet Etch is a dual acid system Wide range of on demand mix ratios Flexible for future packaging materials Kit Packages for known IC packages QFN, SO, BGA, uBGA, FPGA, Hybrids, etc. Full Technical and Applications support

Delayering Die Omnietch utilizes wet chemistry to delayer integrated circuits Keep ICs Fully Planar Preserve Vias and lower layers Remove Copper Aluminum Oxides Titanium/Titanium Nitride Tantalum/Tantalum Nitride Nitrides

IC Tester – JDI

ATV Digital IC Tester Expandable Architecture Expandable to 400 pins Performance of High Cost Console Systems Diverse Modes Functional Testing Scan Edge Characterization, Timing Measurement, and Automated Testing of Memories ASICS FPGAs and PLDs Microprocessors and DSPs Mixed Memory / Logic Devices Designed for remote testing of DUTs Test head can be remote (to 100 ft) Test without Testhead (Passive) Built in Cable Delay Compensation Environment Testing- SER, Radiation, Burn In Test Vector Generated Algorithmically Generate Test Vectors on the fly Fast Hardware Loop (Vector Per Clock) TEST Complex parts-FLASH, SDRAM Multiplex Addr / Data / Compare Patterns on Same Pins Import Test Vectors. Combine Algorithmic and Import Vectors in One Program Visual Pin Assignment Pins are assigned using a simple graphical interface Utilize a pull down list to coordinate pin assignments with timing diagrams Real Time Logical to Physical Map See errors in physical layout (x / y) Scroll through previous test errors Address and bit of each error displayed as mouse flies over error Logical to physical relations entered using reverse-polish calculator Error Log See expected and error patterns Double click on error to see algorithmic step or imported vector where error occurred Failed bits highlighted on import vector file

PWS Analog IC Tester Highly Versatile Analog I/V tester with built in switch matrix Data Log Graph Tools Analysis and Programming Tools For Characterization, Automated testing, Parameter Extraction, Part Sorting, Statistical Process Control of FETs Bipolar Transistors Test Structures OpAmps Analog Circuits Expandable Architecture SMU Card 4 SMUs, 4 Voltage sources per Card 16x6 Guarded Switch Matrix Cards 3 Operating Modes DC PULSE SERVO 3 Measurement Modes DISCRETE SWEEP STEPPED-SWEEP