High Technology Solutions (HTS) is a full-service test manufacturing sales representation firm focused on complete end to end solutions from back-end test and measurement to back-end quality control and recovery. At HTS, we are committed to meeting the needs of our customers and manufacturers in the highly competitive electronics world by providing reliable sales representation and third party services.

Pick and Place Test Handlers –Delta Design

Edge Parallelism: x1 up to x16 Soak Capacity: up to 176 parts Test-site pitch: adjustable for any load-board Up to 7 Output tray locations Options: lead/ball inspection, image sensor, RF package, 2D-ID reader, device rotator Up to 8,600 uph Temperature: chamberless ambient-hot 85 msec/device index time (x8 configuration) Handling of 3x3 mm and larger Packages (small form factor QFNs, WLCSPs) Tool-less Kit Changeover (<20 min typical) High Mean Units Between Assist Auto Contactor Cleaning Automatic Retest at End-of-Lot

Matrix Parallelism: x1 up to x32 Throughput: 10,000 uph or 16,000 uph Temperature: ambient-hot, tri-temperature, +175°C optional Soak Capacity: 3 to 5.5 trays Test-site pitch: adjustable for any load-board (pick-and-place or gravity) Vision Alignment Option Up to 10 configurable Input/Output tray stack locations Up to 16,000 uph at temperature (large soak capacity) 50 msec/device index time (x16 configuration) Handling of 3x3 mm and larger Packages (small form factor QFNs, WLCSPs) Tool-less Kit Changeover High Mean Units Between Assist Continuous Load and Unload Auto Contactor Cleaning Predictive Maintenance Monitoring Automatic Retest at End-of-Lot Chamberless Tri-Temperature ranges from -55°C up to +175°C Active Thermal Control per Site up to x32 Parallelism Vision Alignment with ± 40 µm Positional Accuracy Analog ICs with short test times and high throughput Automotive devices requiring high thermal accuracy Small pitch wireless-communication products High parallelism microcontroller testing Customizeable for the unique requirements of many other device market segments

Castle Parallelism: x1 up to x9 Up to 8 Output tray locations Device Rotator Option Handles QFP, µBGA, BGA, QFN, CSP, SOIC, PLCC, etc. Up to 5,200 uph Tri-Temperature Handler 85 msec/device index time (x8 configuration) Handling of 4x4 mm and larger Packages Tool-less Kit Changeover (<30 min typical) Auto Contactor Cleaning Automatic Retest at End-of-Lot

ETC 2000 Set point ranges: -10° to +150°C, +/- 1°C with 0.1°C resolution; -50°C optional Thermal Unit (TU) sizes: 0.8", 1.0", 1.2", and 1.5" Control Modes: HTF - Heater Temperature Feedback, DTF - Device Temperature Feedback, PF - Power Following (patented) Unique thermal chamber permits fast device changeover regardless of setpoint 8-channel on-system data acquisition for precise tracking of thermal performance parameters Power Balancing™ for precise junction temperature control (patented) Full PID ramp control Accommodates power densities up to 100 Watts/cm² Control Accuracy: < 3°C at 50 Watts/cm² on C4 devices (< 5°C most other packages)

ETC 3000 Test Site Parallelism: x1 (up to x4 optional) Set point ranges: Ambient to +160°C, +/- 1°C -25°C to +125°C (optional) -55°C to +160°C (optional) Thermal Unit (TU) sizes: 0.5", 0.75", 1.0", 1.25", and 1.5" Control Modes: HTF - Heater Temperature Feedback, DTF - Device Temperature Feedback, PF - Power Following (patented) Unique thermal chamber permits fast device change over regardless of set point 8-channel on-system data acquisition for precise tracking of thermal performance parameters Power Balancing™ for precise junction temperature control (patented) Maximum Power Dissipation: 500 Watts (1 device) Accommodates power densities up to 100 Watts/cm² Control Accuracy: +/-1°C with 0.1°C resolution Full PID ramp control

Gravity IC Test Handlers – Delta-Rasco

SO1000 Single, Dual, Quad Contacting Throughput up to 14,400 IC’s/hour Index Time < 0.45 s Conversion kits for all SO and QFN devices Split kit capability Ambient/Hot/Tri-Temp -60C to +175C Large variety of Contactors: Kelvin, RF, Pogo, ECT Johnstech, Yamaichi, C-Type MEMS applications for magnetic, optical, pressure and acoustic sensors Automatic tube loading and unloading Rotary Track (RT) option: Soak capacity 16 Tubes Small Footprint

SO1800 Up to 8 Contact Sites Throughput up to 28,800 IC’s/hour Index Time <0.45 s Conversion kits for all SO, QFN and TO devices Split kit capability Ambient/Hot/Tri-Temp -60C to +175C Large variety of Contactors: Kelvin, RF, Pogo, ECT Johnstech, Yamaichi, C-Type MEMS applications for magnetic, optical, pressure and acoustic sensors Automatic tube and metal magazine loading and unloading Rotary Track (RT) option: Soak capacity 16 Tubes

SO2000 Single, Dual, Quad Contacting Throughput up to 16,000 IC’s/hour Index Time <0.45 s Conversion kits for all SO and QFN devices INCLUDING 1.5 mm x 1.5 mm x 0.4mm 49 mill, 51 mill, 63 mill SOT Devices Split kit capability Ambient/Hot/Tri-Temp -60C to +175C Large variety of Contactors: Kelvin, RF, Pogo, ECT Johnstech, Yamaichi, C-Type MEMS applications for magnetic, optical, pressure and acoustic sensors Multiple input and output modules: Tube, bowl (SOT and QFN), metal magazine, bulk, tape & reel Vision for Mark/3D-lead/intape inspection Small Footprint

SO2800 Up to 8 contact sites Loadboard compatibility Throughput up to 28,800 IC’s/hour Index Time <0.45 s Conversion kits for all SO and QFN devices INCLUDING 1.5 mm x 1.5 mm x 0.4mm 49 mill, 51 mill, 63 mill SOT Devices Split kit capability Ambient/Hot/Tri-Temp -60C to +175C Large variety of Contactors: Kelvin, RF, Pogo, ECT Johnstech, Yamaichi, C-Type MEMS applications for magnetic, optical, pressure and acoustic sensors Multiple input and output modules: Tube, bowl (SOT and QFN), metal magazine, bulk, tape & reel Vision for Mark/3D-lead/intape inspection Small Footprint

SO3000 Parallel testing with multiple contact sites Index time; 150 ms device to device, 1.8 s strip to strip Slotted or stacked cassette loading/unloading Ambient/Hot/Tri-Temp -60C to +160C All common types of lead frame and substrate based strips Integrated Strip code reader at input and output SMEMA module interconnection Strip mapping according to SEMI standard, different protocols for host communication Automatic strip alignment with vision system for extremely high positioning accuracy Adjustable test force up to 2,000 N Integrated laser marker Additional soak module for higher soak capacity

Test Head Positioning and Hard Docking – inTest

Test Head Positioner Utilize 6 different kinds of motion to quickly position the test head for alignment to a handler or prober. UL, EU, Semi certified Approved supplier of Positioner's for Teradyne Credence Eagle LTX Nextest KVD Positioner’s are tested to handle loads from 50 KG to 700KG Our positioner's allow you to change test set-ups fast, Powered Axis Vertical Horizontal Tumble Twist

Docking Hardware When you choose inTEST, you get the finest docking available, from the most experienced team in the industry. inTEST has designed and manufactured more than 5,000 docking systems for over 175 different test heads, 30 prober types, And 300 different handlers. Approved supplier for the following tester companies Teradyne Credence Eagle LTX Nextest KVD Designed with Precision mechanical components to decrease set up time, increase hardware Reliability and life time fine and course alignment features allowing your tester to engage peripheral equipment with out damaging costly hardware

Prober Interface – inTest

Prober Interface Increased yield through Unsurpassed Signal integrity Invisible to the tester Precision mechanical components to decrease set up time Approved supplier for Teradyne Credence Eagle LTX Nextest KVD Modular design allows you to increase the pin count as your tester channels increase

Non-Destructive Internal Failure Analysis – Sonoscan

AW200 Series C-SAM® Sonoscan Waterfall™ transducer provides non-immersion scanning which minimizes risks of contamination and false bond indications Dual (2) high-precision robot arms with vacuum pickup end effectors maximize total throughput by efficiently automating the entire inspection process including aligning, delivery, drying and sorting Functions with up to three 25-wafer cassettes (two for loading/ unloading and one for reject) for larger batch capacity Universal cassette interface platform capable of handling wafers from 125mm to 200mm in diameter. Platforms for smaller wafer sizes are also available Sonoscan automated analysis software accurately determines percent bond/nonbonded, void size and count, and automatic accept/reject based on user-defined criteria Matched 500 MHz bandwidth pulser/receiver and ultra-high resolution transducers rapidly generate Superior images as both are designed and manufactured by Sonoscan for optimum performance Self-contained water and vacuum unit option quickly provides these capabilities when hook-ups are not available

Gen-5 Turbo Mode™: up to 2.5X Faster Scanning Semi-Production Capable with a Two JEDEC Tray Scan Area (1 sq. ft.) Clean Room Ready Open Access for Easy Loading & Unloading ESD Safe Multi-Language Menus & OS™ (English, Traditional Chinese & Japanese) Integrated C-SAM® Interactive for AM Imaging Guidance & Reference Gated Trigger Mode for Elimination of Background Noise Bright Ambient Sample Stage Lighting Active Sensor Detects Presence of Installed Transducer Advanced Applications Software Wafer Analysis Bondline Analysis for Zero-Level Packaging Region Specific Analysis for Electronic Devices Improved TrayScan™ Flip Chip Underfill Void & Solder Bump Support Numerous Time Saving and Operator Convenience Features Virtual Rescanning Mode (VRM™) with Profile and Frequency Domain Imaging (FDI™) Capabilities Available

D-9500 Time Domain Imaging (TDI)™ Balanced Linear Scanner Larger Maximum Scan Area, While Maintaining Accuracy More Accessibility to Samples Multi-Language OS and Visual Acoustics™ Interface Digital Image Analysis (DIA)™ Optional Waterfall Transducer™ Optional Temperature Control Options Applications Set-up Wizard™ Quantitative B-Scan Analysis Mode (Q-BAM)™

P300 A unique carrier system enables operators to load one tray while another is being scanned to help maximize throughput and productivity Higher throughput achieved with better handling procedures, precise positioning, faster scanning and automated analysis. Visual Poly-Gate™ technology for simple and instant multiple depth AM imaging Multi-Language OS and intuitive Sonolytics™ Operator Interface with admin/op levels allows technicians and operators to work easily and efficiently in their native language. Includes English, Chinese and Japanese Ergonomic features including two available work surface height choices for operator comfort and efficiency Minimal footprint for optimum use on the manufacturing floor

FACTs Sonoscan Waterfall™ transducer provides non-immersion scanning, which minimizes risks of contamination, fluid ingression and movement due to floating of parts In-line or stand-alone operation flexibility to best meet your production and quality control requirements Automated Data Analysis Package allows you to predefine accept/reject criteria and automatically indicates rejected parts within the data image or file TurboSpeed™ provides faster imaging speeds at high frequencies with up to 2.5X increased image acquisition speed with high pixel densities Vacuum Hold-Down option holds small parts in place and eliminates shifting during scanning to ensure the highest quality images Four-stage dryer with three air knives and vacuum unit to quickly and efficiently dry parts after scanning Temperature control options to maintain precise water temperature and ensure consistent imaging throughout the day, regardless of changes in ambient air temperature

SonoLab Materials Characterization and Qualification High-Capacity Screening and Lot Reclamation Failure Analysis Inspection and Audit Services Training Qualification Programs IPC/JEDEC NASA EIA/ECA (Electronic Components Assoc.) Military Standard Military Performance Specification

Mark, Pack and Visual Inspection – MicroVision

MV 996i High Speed Tray to Tray 3D Inspection Transfer of multiple units to 3D scanning on a magnetic linear slide achieving finest accuracy producing repeatable results 3D inspection on the “FLY" with a field of view up to 50mm, without use of a rotary lens or kit Simple conversion 5 Minute conversion Keyless chuck for changeover no tools required Utilize a multiple pick up head Dual pick and place mechanism for the reject and replenish station Mark re-verification and position of the unit in tray after inspection Optional Dual Tape and Reel output Mark Inspection Missing, incomplete or incorrect characters and logos, including Smeared, blurred, scratched, low contrast, angel, misaligned, reversed, double and additional mark Package Visual Inspection 60X60 um Detection of Scratches, Chip Out, Void's and Contamination UPH 40K

MV 998D 3D inspection on the “FLY" with a field of view up to 50mm, without use of a rotary lens or kit Revolutionized 3 pickup head mechanism Built in Auto Precisor Keyless no tools required to adjust when changing the package size In tray mark inspection Missing, incomplete or incorrect characters and logos, including Smeared, blurred, scratched, low contrast, angel, misaligned, reversed, double and additional mark Dual Tape and Reel 2D vision for In Tape, Orientation, and Gross Lead Inspection Auto replacement mechanism Simple conversion 30 Minute conversion time from device type too type 3 Pickup heads with built in precisor designed to adjust automatically to different size packages Package Visual Inspection 60X60 um Detection of Scratches, Chip Out, Void’s and Contamination PH 10K

Deprocessing Failure Analysis Equipment – Nisene

Package Decap Jet Etch is a dual acid system Wide range of on demand mix ratios Flexible for future packaging materials Kit Packages for known IC packages QFN, SO, BGA, uBGA, FPGA, Hybrids, etc. Full Technical and Applications support

Delayering Die Omnietch utilizes wet chemistry to delayer integrated circuits Keep ICs Fully Planar Preserve Vias and lower layers Remove Copper Aluminum Oxides Titanium/Titanium Nitride Tantalum/Tantalum Nitride Nitrides